patents

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summary of patents

Patent number: 8272533

Abstract: A device for dispensing cutlery utensils individually, having a housing containing a quantity of utensils with the housing having sides and product guides within. The front wall contains an opposing leaf escapement mechanism connected to it, to hold and singulate the utensils such that they dispense seriatim, without a user being required to physically touch or interface with any part of dispenser other than the actual desired utensil.

Type: Grant
Filed: July 7, 2010
Issued: September 25, 2012
Inventors: Anthony D’Amelia, Mark V. Pierson

Patent number: 8089133

Abstract: Optical cubes and optical cube assemblies for directing optical beams are provided. The optical cubes are optically transparent modules that can be adapted to reflect, transmit, and/or partially reflect and transmit optical beams. The optical cubes may include bi-direction or multi-direction beam directing elements for directing optical beams. The optical cube assemblies may include flexible chip assemblies attached to optical cubes. The chip assemblies may include vertical cavity surface-emitting lasers for emitting optical beams or receivers for receiving optical beams mounted on a flexible and electrical interconnect mounting assembly.

Type: Grant
Filed: November 19, 2004
Issued: January 3, 2012
Assignee: International Business Machines Corporation
Inventors: Dinesh Gupta, Brenda L. Peterson, Mark V. Pierson, Eugen Schenfeld, Subhash L. Shinde

Patent number: 7718902

Abstract: The current invention provides a method of attaching a plurality of cores wherein a core has a via with a conductive surface to be electrically connected to a conductive surface on another core. The method provides for applying a metallurgical paste to a conductive surface, removing a portion of the flux from the paste and joining the two cores. The current invention also provides a structure including a plurality of cores wherein a metallurgical paste electrically connects a via with a conductive surface on a core to a conductive surface on another core.

Type: Grant
Filed: September 9, 2004
Issued: May 18, 2010
Assignee: International Business Machines Corporation
Inventors: Lisa J. Jimarez, Mark V. Pierson

Patent number: 6980392 

Abstract: Under the present invention, a contaminant capturing material is positioned within a disk drive. Specifically, the contaminant capturing material is positioned on a suspension, adjacent a slider that hovers proximate a disk within the disk drive when the disk is in rotation. The contaminant capturing material will prevent contaminants from contacting the disk and thereby causing damage. In addition, a set of porous, open celled filters that are coated with the contaminant capturing material can also be provided. If used, the open celled filters are positioned adjacent the disk within an air stream created by a rotation of the disk.

Type: Grant
Filed: April 8, 2003
Issued: December 27, 2005
Assignee: International Business Machines Corporation
Inventor: Mark V. Pierson

Patent number: 6955982

Abstract: An electrical structure, and associated method of fabrication, for reducing thermally induced strain in a structure that couples a first conductive body of a first substrate to a second conductive body of a second substrate (e.g., a chip to a chip carrier; a chip carrier to a circuit card). The melting point of the first conductive body exceeds the melting point of the second conductive body. The second conductive body may include eutectic lead-tin alloy, while the first conductive body may include non-eutectic lead-tin alloy. A portion of the first conductive body is coated with, or volumetrically surrounded by, a material that is nonsolderable and nonconductive. The first and second conductive bodies are coupled mechanically and electrically by surface adhesion at an uncoated portion of the first conductive body, by application of a temperature that lies between the melting points of the first and second conductive bodies.

Type: Grant
Filed: November 18, 2003
Issued: October 18, 2005
Assignee: International Business Machines Corporation
Inventors: Miguel A. Jimarez, Cynthia S. Milkovich, Mark V. Pierson

Patent number: 6922294

Abstract: An optical assembly comprising an optical cube. A first optical transmitter chip and a first optical receiver chip are mounted on one surface of the optical cube. A first continuous printed circuit board is soldered to electrical surfaces of the first optical transmitter chip and the first optical receiver chip opposite the optical cube. A second optical transmitter chip and a second optical receiver chip are mounted on an opposite surface of the optical cube. A second continuous printed circuit board is soldered to electrical surfaces of the second optical transmitter chip and the second optical receiver chip opposite the optical cube. The first optical transmitter chip is optically aligned with the second optical receiver chip through the optical cube. The second optical transmitter chip is optically aligned with the first optical receiver chip through the optical cube.

Type: Grant
Filed: May 2, 2003
Issued: July 26, 2005
Assignee: International Business Machines Corporation
Inventors: Mark V. Pierson, Eugen Schenfeld

Patent number: 6917728

Abstract: An attachment structure, and an associated method and system for forming the attachment structure. An end of an optical fiber is melted while the end is above, but not touching, an exposed surface of a substrate such that said end becomes molten. The optical fiber is substantially optically transparent to laser radiation of a given wavelength. The molten end is moved toward the exposed surface of the substrate until the end makes physical contact with the exposed surface of the substrate. The moving is performed sufficiently fast so that the end is still molten when the end initially makes the physical contact with the exposed surface of the substrate. The physical contact is maintained for a sufficient length of time to enable the end to bond to the exposed surface of the substrate with no intervening matter between the end and the exposed surface of the substrate.

Type: Grant
Filed: June 27, 2003
Issued: July 12, 2005
Assignee: International Business Machines Corporation
Inventors: Michael S. Lemmon, Mark V. Pierson

Patent number: 6836015

Abstract: Optical cubes and optical cube assemblies for directing optical beams are provided. The optical cubes are optically transparent modules that can be adapted to reflect, transmit, and/or partially reflect and transmit optical beams. The optical cubes may include bi-direction or multi-direction beam directing elements for directing optical beams. The optical cube assemblies may include flexible chip assemblies attached to optical cubes. The chip assemblies may include vertical cavity surface-emitting lasers for emitting optical beams or receivers for receiving optical beams mounted on a flexible and electrical interconnect mounting assembly.

Type: Grant
Filed: May 2, 2003
Issued: December 28, 2004
Assignee: International Business Machines Corporation
Inventors: Monty M. Denneau, Dinesh Gupta, Lisa J. Jimarez, Steven Ostrander, Brenda L. Peterson, Mark V. Pierson, Eugen Schenfeld, Subhash L. Shinde

Application number: 20040218288

Abstract: An optical assembly comprising an optical cube. A first optical transmitter chip and a first optical receiver chip are mounted on one surface of the optical cube. A first continuous printed circuit board is soldered to electrical surfaces of the first optical transmitter chip and the first optical receiver chip opposite the optical cube. A second optical transmitter chip and a second optical receiver chip are mounted on an opposite surface of the optical cube. A second continuous printed circuit board is soldered to electrical surfaces of the second optical transmitter chip and the second optical receiver chip opposite the optical cube. The first optical transmitter chip is optically aligned with the second optical receiver chip through the optical cube. The second optical transmitter chip is optically aligned with the first optical receiver chip through the optical cube.

Type: Application
Filed: May 2, 2003
Issued: November 4, 2004
Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventors: Mark V. Pierson, Eugen Schenfeld

Application number: 20040217464

Abstract: Optical cubes and optical cube assemblies for directing optical beams are provided. The optical cubes are optically transparent modules that can be adapted to reflect, transmit, and/or partially reflect and transmit optical beams. The optical cubes may include bi-direction or multi-direction beam directing elements for directing optical beams. The optical cube assemblies may include flexible chip assemblies attached to optical cubes. The chip assemblies may include vertical cavity surface-emitting lasers for emitting optical beams or receivers for receiving optical beams mounted on a flexible and electrical interconnect mounting assembly.

Type: Application
Filed: May 2, 2003
Issued: November 4, 2004
Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventors: Monty M. Denneau, Dinesh Gupta, Lisa J. Jimarez, Steven Ostrander, Brenda L. Peterson, Mark V. Pierson, Eugen Schenfeld, Subhash L. Shinde

Patent number: 6805280

Abstract: The current invention provides a method of attaching a plurality of cores wherein a core has a via with a conductive surface to be electrically connected to a conductive surface on another core. The method provides for applying a metallurgical paste to a conductive surface, removing a portion of the flux from the paste and joining the two cores. The current invention also provides a structure including a plurality of cores wherein a metallurgical paste electrically connects a via with a conductive surface on a core to a conductive surface on another core.

Type: Grant
Filed: January 8, 2002
Issued: October 19, 2004
Assignee: International Business Machines Corporation
Inventors: Lisa J. Jimarez, Mark V. Pierson

Application number: 20040201917

Abstract: Under the present invention, a contaminant capturing material is positioned within a disk drive. Specifically, the contaminant capturing material is positioned on a suspension, adjacent a slider that hovers proximate a disk within the disk drive when the disk is in rotation. The contaminant capturing material will prevent contaminants from contacting the disk and thereby causing damage. In addition, a set of porous, open celled filters that are coated with the contaminant capturing material can also be provided. If used, the open celled filters are positioned adjacent the disk within an air stream created by a rotation of the disk.

Type: Application
Filed: April 8, 2003
Issued: October 14, 2004
Assignee: International Business Machines Corporation
Inventor: Mark V. Pierson

Patent number: 6774472

Abstract: A method of forming a plurality of individual semiconductor chip modules wherein a plurality of chips are placed in a plurality of chip compartments formed by adhering a support panel to the first surface and a cover panel to the second surface of a stiffener panel having openings defining sidewalls of the chip compartments. The resulting laminated panel structure is then cut into a plurality of modules each having at least one compartment containing at least one chip. Each chip is electrically connected to interior conductive pads on the inner surface of the support panel, and these interior pads in turn are connected by conductive paths to exterior conductive terminals deposited on the outer surface of the support panel. The electrical connections between the chip and the interior conductive pads of the support panel may be encapsulated in a polymeric material before the cover panel is adhered to the stiffener panel.

Type: Grant
Filed: September 17, 2002
Issued: August 10, 2004
Assignee: International Business Machines Corporation
Inventor: Mark V. Pierson

Patent number: 6770968

Abstract: A method for bonding heat sinks to packaged electronic components comprises the steps of: (a) exposing to a plasma a surface of a molded polymer formed on a substrate; (b) allowing the plasma to at least partially convert silicon-containing residue on the surface to silica; and (c) bonding an article to the surface by applying an adherent between the article and the surface. Often, the silicon-containing residue is silicone oil, a mold release compound, which may prevent the formation of a bond when using conventional bonding methods and materials. The silica layer formed on the surface of the molded polymer assists in formation of a proper bond. The plasma may be an oxygen plasma and the adherent may be selected from either a heat cured silicone-based paste adhesive with a metal oxide filler or a heat cured porous polymer film impregnated with adhesive.

Type: Grant
Filed: February 19, 2003
Issued: August 3, 2004
Assignee: International Business Machines Corporation
Inventors: Frank D. Egitto, Michael A. Gaynes, Ramesh R. Kodnani, Luis J. Matienzo, Mark V. Pierson

Patent number: 6756680

Abstract: An electrical structure, and associated method of fabrication, for reducing thermally induced strain in a structure that couples a first conductive body of a first substrate to a second conductive body of a second substrate (e.g., a chip to a chip carrier; a chip carrier to a circuit card). The melting point of the first conductive body exceeds the melting point of the second conductive body. The second conductive body may include eutectic lead-tin alloy, while the first conductive body may include non-eutectic lead-tin alloy. A portion of the first conductive body is coated with, or volumetrically surrounded by, a material that is nonsolderable and nonconductive. The first and second conductive bodies are coupled mechanically and electrically by surface adhesion at an uncoated portion of the first conductive body, by application of a temperature that lies between the melting points of the first and second conductive bodies.

Type: Grant
Filed: February 12, 2001
Issued: June 29, 2004
Assignee: International Business Machines Corporation
Inventors: Miguel A. Jimarez, Cynthia S. Milkovich, Mark V. Pierson

Patent number: 6699736

Abstract: A method and structure for conductively coupling a metallic stiffener to a chip carrier. A substrate has a conductive pad on its surface and an adhesive layer is formed on the substrate surface. The metallic stiffener is placed on the adhesive layer, wherein the adhesive layer mechanically couples the stiffener to the substrate surface and electrically couples the stiffener to the pad. The adhesive layer is then cured such as by pressurization at elevated temperature. Embodiments of the present invention form the adhesive layer by forming an electrically conductive contact on the pad and setting a dry adhesive on the substrate, such that the electrically conductive contact is within a hole in the dry adhesive. The electrically conductive contact electrically couples the stiffener to the pad. The curing step includes curing both the dry adhesive and the electrically conductive contact, resulting in the dry adhesive adhesively coupling the stiffener to the substrate.

Type: Grant
Filed: November 26, 2002
Issued: March 2, 2004
Assignee: International Business Machines Corporation
Inventors: Terry J. Dornbos, Raymond A. Phillips, Jr., Mark V. Pierson, William J. Rudik, David L. Thomas

Patent number: 6674647

Abstract: Self-aligning combination of a substrate with a chip is provided, using reverse patterns of raised recesses and raised shapes on the respective substrate and chip surfaces. High-force contact bump production is avoided. Reliable contact between a chip and substrate is achieved, with minimized skewing after chip placement.

Type: Grant
Filed: January 7, 2002
Issued: January 6, 2004
Assignee: International Business Machines Corporation
Inventors: Mark V. Pierson, Ajit K. Trivedi

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